Carrier and adhesion amount measuring apparatus, and measuring method, program, and recording medium of the same

ABSTRACT

The present invention measures a quantity of attachment (such as density) of a material (such as catalyst and promoter) attached to a carrier. A carrier  1  includes attachment holes  12  to which a catalyst  24  attaches, and non-attachment holes  14  to which the catalyst  24  does not attach, where extension directions of the attachment holes  12  and the non-attachment holes  14  are parallel with each other (perpendicular to a first end surface  1   a ), and are opened on the first end surface  1   a  and a second end surface  1   b.  An attachment quantity measurement device includes an electromagnetic wave output device  2  that outputs a terahertz wave at a frequency equal to or more than 0.01 [THz] and equal to or less than 100 [THz] toward the carrier  1,  an electromagnetic wave detector  4  that detects the terahertz wave which has transmitted through the carrier  1,  a reference value deriving unit  7  that derives, based on a result detected by the electromagnetic wave detector  4,  any one of an absorption rate, a group delay, and a dispersion of the terahertz wave in the non-attachment holes  14,  and an attachment quantity deriving unit  8  that derives, based on the result detected by the electromagnetic wave detector  4  and the result derived by the reference value deriving unit  7,  a weight or a density of the catalyst  24  present in the attachment holes  12.

BACKGROUND ART

1. Field of the Invention

The present invention relates to measurement of a density of a catalystor promoter component in a carrier to which the catalyst or promoter isattached using an electromagnetic wave (frequency thereof is equal to ormore than 0.01 [THz], and equal to or less than 100 [THz]) (such as aterahertz wave (frequency thereof is equal to or more than 0.03 [THz],and equal to or less than 10 [THz]), for example).

2. Description of the Prior Art

Conventionally, a carrier made of a ceramic has been immersed in asolution or suspension of a catalyst or promoter, the catalyst orpromoter attaches to the carrier, and an oxidation catalyst forautomobiles and the like and an electrode for a fuel cell are thenobtained.

It should be noted that the applicant does not know prior art documentsdescribing the measurement of the quantity of the catalyst or promoter(such as density) attached to the carrier.

SUMMARY OF THE INVENTION

It is an object of the present invention to measure a quantity ofattachment (such as density) of a material (such as catalyst andpromoter) attached to a carrier.

According to the present invention, a carrier includes: an attachmenthole to which a predetermined component attaches; and a non-attachmenthole to which the predetermined component does not attach.

According to the thus constructed carrier, a predetermined componentattaches to an attachment hole. The predetermined component does notattach to a non-attachment hole.

According to the carrier of the present invention, the direction of anextension of the attachment hole and the direction of an extension ofthe non-attachment hole may be parallel with each other.

The carrier according to the present invention may includes two endsurfaces that are parallel with each other, wherein the attachment holeand the non-attachment hole open on the two end surfaces.

The present invention is a method of manufacturing the carrier of thepresent invention, wherein the carrier includes a plurality of holeshaving a first opening portion and a second opening portion on anopposite side with respect to the first opening portion, the method ofmanufacturing the carrier including: a step of closing the first openingportion and the second opening portion of a part of the plurality ofholes; and a step of immersing the carrier in a liquid in which thepredetermined component is present.

The present invention is a method of manufacturing the carrier of thepresent invention, wherein the carrier includes a plurality of holeshaving a first opening portion and a second opening portion on anopposite side with respect to the first opening portion, and a first endsurface on which the first opening portion opens, the method ofmanufacturing the carrier including: a step of closing the first openingportion of a part of the plurality of holes; and a step of splaying,toward the first end surface, a liquid in which the predeterminedcomponent is present.

The present invention is a method of manufacturing the carrier of thepresent invention, wherein the carrier includes a plurality of holeshaving a first opening portion and a second opening portion on anopposite side with respect to the first opening portion, a first endsurface on which the first opening portion opens, and a second endsurface on which the second opening portion opens, the method ofmanufacturing the carrier including: a step of closing the secondopening portion of a part of the plurality of holes; and a step ofimmersing the carrier in a liquid in which the predetermined componentis present such that the liquid surface of the liquid is higher than thesecond end surface and lower than the first end surface.

The present invention is a method of manufacturing the carrier of thepresent invention, wherein the carrier includes a plurality of holeshaving a first opening portion and a second opening portion on anopposite side with respect to the first opening portion, and a first endsurface on which the first opening portion opens, the method ofmanufacturing the carrier including: a step of immersing the carrier ina liquid in which the predetermined component is present such that theliquid surface of the liquid is lower than the first opening portion ofa part of the plurality of holes.

According to the present invention, an attachment quantity measurementdevice includes: an electromagnetic wave output device that outputs anelectromagnetic wave to be measured having a frequency equal to orhigher than 0.01 [THz] and equal to or lower than 100 [THz] toward thecarrier of the present invention; an electromagnetic wave detector thatdetects the electromagnetic wave to be measured which has transmittedthrough the carrier; a reference value deriving unit that derives, basedon a result detected by the electromagnetic wave detector, any one of anabsorption rate, a group delay, and a dispersion of the electromagneticwave to be measured in the non-attachment hole; and an attachmentquantity deriving unit that derives, based on the result detected by theelectromagnetic wave detector and the result derived by the referencevalue deriving unit, a weight or a density of the predeterminedcomponent present in the attachment hole.

According to the thus constructed attachment quantity measurementdevice, an electromagnetic wave output device outputs an electromagneticwave to be measured having a frequency equal to or higher than 0.01[THz] and equal to or lower than 100 [THz] toward the carrier of thepresent invention. An electromagnetic wave detector detects theelectromagnetic wave to be measured which has transmitted through thecarrier. A reference value deriving unit derives, based on a resultdetected by the electromagnetic wave detector, any one of an absorptionrate, a group delay, and a dispersion of the electromagnetic wave to bemeasured in the non-attachment hole. An attachment quantity derivingunit derives, based on the result detected by the electromagnetic wavedetector and the result derived by the reference value deriving unit, aweight or a density of the predetermined component present in theattachment hole.

According to the present invention, the attachment quantity measurementdevice of the present invention, includes: a rotational drive unit thatrotates the carrier or a travel direction of the electromagnetic wave tobe measured while a line in a direction perpendicular to the traveldirection of the electromagnetic wave to be measured is set as arotational axis; and a linear drive unit that moves the carrier or thetravel direction of the electromagnetic wave to be measured in adirection perpendicular to the travel direction of the electromagneticwave to be measured and the rotational axis, wherein the detection iscarried out by the electromagnetic wave detector while the rotationaldrive unit and the linear drive unit are operating.

The present invention is an attachment quantity measurement method usingan attachment quantity measurement device including: an electromagneticwave output device that outputs an electromagnetic wave to be measuredhaving a frequency equal to or higher than 0.01 [THz] and equal to orlower than 100 [THz] toward the carrier of the present invention; and anelectromagnetic wave detector that detects the electromagnetic wave tobe measured which has transmitted through the carrier; the attachmentquantity measurement method including: a reference value deriving stepthat derives, based on a result detected by the electromagnetic wavedetector, any one of an absorption rate, a group delay, and a dispersionof the electromagnetic wave to be measured in the non-attachment hole;and an attachment quantity deriving step that derives, based on theresult detected by the electromagnetic wave detector and the resultderived by the reference value deriving step, a weight or a density ofthe predetermined component present in the attachment hole.

The present invention is a program of instructions for execution by acomputer to perform an attachment quantity measurement process using anattachment quantity measurement device including: an electromagneticwave output device that outputs an electromagnetic wave to be measuredhaving a frequency equal to or higher than 0.01 [THz] and equal to orlower than 100 [THz] toward the carrier of the present invention; and anelectromagnetic wave detector that detects the electromagnetic wave tobe measured which has transmitted through the carrier; the attachmentquantity measurement process including: a reference value deriving stepthat derives, based on a result detected by the electromagnetic wavedetector, any one of an absorption rate, a group delay, and a dispersionof the electromagnetic wave to be measured in the non-attachment hole;and an attachment quantity deriving step that derives, based on theresult detected by the electromagnetic wave detector and the resultderived by the reference value deriving step, a weight or a density ofthe predetermined component present in the attachment hole.

The present invention is a computer-readable medium having a program ofinstructions for execution by a computer to perform an attachmentquantity measurement process using an attachment quantity measurementdevice including: an electromagnetic wave output device that outputs anelectromagnetic wave to be measured having a frequency equal to orhigher than 0.01 [THz] and equal to or lower than 100 [THz] toward thecarrier of the present invention; and an electromagnetic wave detectorthat detects the electromagnetic wave to be measured which hastransmitted through the carrier; the attachment quantity measurementprocess including: a reference value deriving step that derives, basedon a result detected by the electromagnetic wave detector, any one of anabsorption rate, a group delay, and a dispersion of the electromagneticwave to be measured in the non-attachment hole; and an attachmentquantity deriving step that derives, based on the result detected by theelectromagnetic wave detector and the result derived by the referencevalue deriving step, a weight or a density of the predeterminedcomponent present in the attachment hole.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1( a) is a front view of a carrier 1 according to a firstembodiment of the present invention, and FIG. 1( b) is a cross-sectionalview of a part II of the carrier 1;

FIGS. 2( a) and 2(b) show a configuration of an attachment quantitymeasurement device according to the first embodiment, in which FIG. 2(a) is a plan view and FIG. 2( b) is a partial front view;

FIG. 3( a) is a front view of the carrier 1 before the attachment of thecatalyst 24 according to the second embodiment, and FIG. 3( b) is across-sectional view of the part II of the carrier 1;

FIG. 4 is a partial cross-sectional view (corresponding to FIG. 3( b))of the carrier 1 according to the second embodiment;

FIG. 5 shows a partial cross-sectional view (corresponding to FIG. 3(b)) of the carrier 1 according to the third embodiment;

FIGS. 6( a) and 6(b) are partial cross-sectional views of the carrier 1according to the fourth embodiment, in which FIG. 6( a) is a partialcross-sectional view of the carrier 1 when the carrier 1 is beingimmersed in the solution 110 (corresponding to FIG. 3( b)), and FIG. 6(b) is a partial cross-sectional view of the carrier 1 after theimmersion in the solution 110 (corresponding to FIG. 3( b)); and

FIG. 7 is a front view when the carrier 1 according to the fifthembodiment is immersed in the solution 110.

BEST MODE FOR CARRYING OUT THE INVENTION

A description will now be given of embodiments of the present inventionwith reference to drawings.

First Embodiment

FIG. 1( a) is a front view of a carrier 1 according to a firstembodiment of the present invention, and FIG. 1( b) is a cross-sectionalview of a part II of the carrier 1.

The carrier 1 according to the first embodiment includes a first endsurface 1 a, and a second end surface 1 b (refer to FIG. 1( b)). Thefirst end surface 1 a and second end surface 1 b are parallel with eachother. The first end surface 1 a and second end surface 1 b are circular(refer to FIG. 1( a)), and the carrier 1 itself is cylindrical. Thecarrier 1 is made of a ceramic.

The carrier 1 according to the first embodiment includes attachmentholes 12 and non-attachment holes 14. In FIG. 1( a), the attachmentholes 12 and non-attachment holes 14 are shown only in a vicinity of thecenter (the same applies to FIGS. 3( a), 3(b), and 7).

It should be noted that the non-attachment holes 14 are arrangedapproximately at the center of the first end surface 1 a in FIG. 1( a).However, the non-attachment holes 14 may not be arranged approximatelyat the center of the first end surface 1 a, and may be arranged in aportion close to the periphery of the first end surface 1 a.

The attachment holes 12 and the non-attachment holes 14 are separatedfrom each other by partition walls 22.

A predetermined component is attached to the attachment holes 12 (innersurfaces of the partition walls 22 enclosing the attachment holes 12).The attached predetermined component is a catalyst 24, for example. Thepredetermined component is not attached to the non-attachment holes 14.The catalyst (predetermined component) 24 attached to the attachmentholes 12 serves as a catalyst which purifies an exhaust gas passingthrough the attachment holes 12. The catalyst (predetermined component)24 is not attached to the non-attachment holes 14, and actions such asthe purification of the exhaust gas and the like is not expected in thenon-attachment holes 14.

It should be noted that the attachment hole 12 and the non-attachmenthole 14 are distinguished from each other according to presence/absenceof the attachment of the catalyst 24 in FIG. 1. On this occasion, thenumber of the types of the catalyst and promoter attached to the carrier1 is not limited to one, and multiple types of them may be attached. Forexample, while catalysts A, B, and C are attached to the attachmentholes 12, only the catalysts A and B are attached to the non-attachmentholes 14, but the catalyst C is not.

The direction of the extension of the attachment holes 12 and that ofthe non-attachment holes 14 are parallel with each other, and both ofthem are perpendicular to the first end surface 1 a and the second endsurface 1 b.

The attachment holes 12 and the non-attachment holes 14 open on thefirst end surface 1 a as well as on the second end surface 1 b. In otherwords, the attachment holes 12 and the non-attachment holes 14 passthrough the carrier 1.

It is assumed that the number of the non-attachment holes 14 isextremely lower than that of the attachment holes 12. As a result, adecrease in performance (such as the purification of the exhaust gas) ofthe carrier 1 due to the presence of the non-attachment holes 14 isnegligible.

A description will now be given of a usage of the carrier 1 according tothe first embodiment.

An exhaust gas or the like flows from the first end surface 1 a into theattachment holes 12. Then, the catalyst 24 attached to the attachmentholes 12 (surfaces on the side of the attachment holes 12 of thepartition walls 22 enclosing the attachment holes 12) causes a chemicalreaction, and the exhaust gas passes through the attachment holes 12while being purified, and is exhausted from the second end surface 1 b.

It should be noted that, before (or after) the carrier 1 is used asdescribed above, the quantity of the catalyst 24 attached to the carrier1 is measured.

FIGS. 2( a) and 2(b) show a configuration of an attachment quantitymeasurement device according to the first embodiment, in which FIG. 2(a) is a plan view and FIG. 2( b) is a partial front view. The attachmentquantity measurement device according to the first embodiment includesan electromagnetic wave output device 2, an electromagnetic wavedetector 4, a scanning stage (rotational drive unit and a linear driveunit) 6, a reference value deriving unit 7, and an attachment quantityderiving unit 8.

In FIG. 2( a), a portion of the non-attachment holes 14 of the carrier 1(referring to FIG. 1( a), three by three of non-attachment holes 14 atthe center) is designated as a reference area A0, and an area other thanthe reference area A0 is designated as a collection area A1. It shouldbe noted that the carrier 1, the electromagnetic wave output device 2,the electromagnetic wave detector 4, and the scanning stage 6 are shown,and the reference value deriving unit 7 and the attachment quantityderiving unit 8 are omitted in FIG. 2( b).

The electromagnetic wave output device 2 outputs an electromagnetic waveat a frequency equal to or more than 0.01 [THz] and equal to or lessthan 100 [THz] (referred to as “electromagnetic wave to be measured”hereinafter) toward the carrier 1. The frequency of the electromagneticwave to be measured output toward the carrier 1 includes a terahertzwave band (such as equal to or more than 0.03 [THz] and equal to or lessthan 10 [THz]). According to the embodiment of the present invention, itis assumed that a terahertz wave is employed as an example of theelectromagnetic wave to be measured.

The terahertz wave output to the carrier 1 transmits through the carrier1. The electromagnetic wave detector 4 detects the electromagnetic waveto be measured (such as a terahertz wave) which has transmitted throughthe carrier 1.

The scanning stage (rotational drive unit and linear drive unit) 6rotates the carrier 1 while a line Z orthogonal to the travel directionof the electromagnetic wave to be measured is set as a rotational axis(rotation in a θ direction). It should be noted that the electromagneticwave output device 2 and the electromagnetic wave detector 4 may berotated while the line Z is set as a rotational axis (which correspondsto the rotation of the travel direction of the electromagnetic wave tobe measured).

The scanning stage 6 moves the carrier 1 in a direction X orthogonal tothe travel direction of the electromagnetic wave to be measured and tothe rotational axis Z (movement in the X direction). It should be notedthat the electromagnetic wave output device 2 and the electromagneticwave detector 4 may be moved in the X direction (which corresponds tothe movement of the travel direction of the electromagnetic wave to bemeasured).

While the scanning stage (rotational drive unit and linear drive unit) 6is in operation, the detection by the electromagnetic wave detector 4 iscarried out.

The reference value deriving unit 7 derives, based on a result detectedby the electromagnetic wave detector 4, any one of an absorption rate, agroup delay, and a dispersion of the terahertz wave in thenon-attachment holes 14. The absorption rate and the like of theterahertz wave in the non-attachment holes 14 can be derived by thewidely-known computer tomography (CT).

The attachment quantity deriving unit 8 derives, based on the resultdetected by the electromagnetic wave detector 4 and the result derivedby the reference value deriving unit 7, a weight (unit thereof is [g],for example) or a density (unit thereof [g/l] (weight per liter), forexample) of the catalyst 24 present in the attachment holes 12.

A description will now be given of an example for causing the attachmentquantity deriving unit 8 to derive, based on the absorption rate of theterahertz wave in the non-attachment holes 14, the density of thecatalyst 24 present in the attachment holes 12.

The absorption rate of the terahertz wave when the density of thecatalyst 24 is 0 is denoted by α0, an increase rate of the absorptionrate of the terahertz wave with respect to the density of the catalyst24 is denoted by β, and the absorption rate of the terahertz wave in theattachment holes 12 is denoted by α. Then, the density of the catalyst24 is represented as (α−α0)/β. It should be noted that β is obtained inadvance, and is recorded in the attachment quantity deriving unit 8.

Since the catalyst 24 is not attached to the non-attachment holes 14, itis considered that the density of the catalyst 24 is 0. Thus, theabsorption rate of the terahertz wave in the non-attachment holes 14derived by the reference value deriving unit 7 is considered as α0.Thus, the attachment quantity deriving unit 8 can acquire α0 from thereference value deriving unit 7.

Moreover, the attachment quantity deriving unit 8 derives a distributionof the absorption rate α of the terahertz wave in the attachment holes12 from the result detected by the electromagnetic wave detector 4 bythe widely-known CT.

Further, the attachment quantity deriving unit 8 assigns β, α0, and α to(α−α0)/β, thereby deriving a distribution of the density of the catalyst24 present in the attachment holes 12.

As described before, while the catalysts A, B, and C are attached to theattachment holes 12, it is conceivable that only the catalysts A and Bare attached to the non-attachment holes 14, but the catalyst C is not.In this case, a distribution of the density of the catalyst C present inthe attachment holes 12 is to be derived.

It should be noted that the reference value deriving unit 7 and theattachment quantity deriving unit 8 may be realize in the followingmanner. A computer is provided with a CPU, a hard disk, and a media(such as a floppy disk (registered trade mark) and a CD-ROM) reader, andthe media reader is caused to read a medium recording a programrealizing the reference value deriving unit 7 and the attachmentquantity deriving unit 8, thereby installing the program on the harddisk. This method may also realize the above-described functions.

According to the first embodiment, since the non-attachment holes 14exist inside the carrier 1 to be measured, an error caused by a passageof time and an error caused by an individual difference of the carrier 1can be neglected. Thus, the characteristics (such as the absorptionrate) of the terahertz wave can be precisely measured when the densityof the catalyst 24 is zero in the carrier 1 to which the catalyst 24attaches. As a result, the distribution of the density of the catalyst24 in the carrier 1 can be precisely derived.

Second Embodiment

A second embodiment is a method of manufacturing the carrier 1 accordingto the first embodiment, and includes a process to place closing members30 on the first end surface 1 a and the second end surface 1 b of thecarrier 1.

FIG. 3( a) is a front view of the carrier 1 before the attachment of thecatalyst 24 according to the second embodiment, and FIG. 3( b) is across-sectional view of the part II of the carrier 1.

The carrier 1 before the attachment of the catalyst 24 includes multipleholes 10. The hole 10 includes a first opening portion 10 a and a secondopening portion 10 b on the opposite side of the first opening portion10 a. The first opening portion 10 a opens on the first end surface 1 a.The second opening portion 10 b opens on the second end surface 1 b.

An arrangement of the multiple holes 10 on the first end surface 1 a isthe same as an arrangement obtained by replacing the attachment holes 12and the non-attachment holes 14 by the holes 10 in the arrangement shownin FIG. 1( a). A hole 10 to which the catalyst 24 is attached is theattachment hole 12. A hole 10 to which the catalyst 24 is not attachedis the non-attachment hole 14.

(Process 2-1) Process of Closing

The first opening portions 10 a and the second opening portions 10 b ofthe part (the three-by-three holes 10 at the center, refer to FIGS. 1(a) and 3(a)) of the multiple holes 10 are closed by the closing member30. Though FIG. 3( a) shows the closing member 30 resting on the firstend surface 1 a, the closing member 30 is similarly placed on the secondend surface 1 b.

(Process 2.2) Process of Immersing

FIG. 4 is a partial cross-sectional view (corresponding to FIG. 3( b))of the carrier 1 according to the second embodiment.

A container 100 stores a solution 110 in which a catalyst or promoter isdissolved as a solute. In the solution 110, a catalyst used forautomobiles (such as three-way catalyst, oxidation catalyst, andreduction catalyst) or a promoter is dissolved as the solute.Alternatively, in the solution, a catalyst or promoter used as anelectrode of a fuel cell is dissolved as a solute. This holds true forthe solution 110 according to third to fifth embodiments.

It should be noted that a description will be given of the embodimentsof the present invention assuming that the solute of the solution 110 isthe catalyst 24.

After the closing members 30 are placed on the first end surface 1 a andthe second end surface 1 b, the carrier 1 is immersed in the solution110. It should be noted that the liquid surface of the solution 110 ispreferably higher than the first end surface 1 a and the second endsurface 1 b.

Then, the solution HO will not flow into the holes 10 (three holes 10 atthe center in FIG. 4), the first opening portion 10 a and second openingportion 10 b of which are closed by the closing members 30. As a result,these holes 10 become non-attachment holes 14.

On the other hand, the solution 110 flows into the rest of the holes 10(two holes 10 on both ends in FIG. 4). As a result, the catalyst 24,which is the solute of the solution 110, attaches to (the partitionwalls 22 enclosing) these holes 10, resulting in the attachment holes12.

The carrier 1 manufactured in this way becomes the carrier 1 as shown inFIG. 1.

It is conceivable to immerse the carrier 1 in the solution 110 withoutthe closing by the closing members 30 in processes other than theprocesses 2-1 and 2-2. As a result, it is possible to attach multipletypes of catalysts and promoters in the attachment holes 12 andnon-attachment holes 14 (the same holds true for the third to fifthembodiments).

For example, it is assumed that the solution 110, in which the catalystC is used as a solute, is used in the process 2-2. Moreover, it isassumed that solutes of the solution 110 in which the carrier 1 withoutthe closing by the closing members 30 is immersed are the catalyst A andcatalyst B. As a result, while catalysts A, B, and C are attached to theattachment holes 12, only the catalysts A and B are attached to thenon-attachment holes 14, but the catalyst C is not.

It should be noted that the description has been given of the embodimentof the present invention assuming that the solute of the solution 110 isthe catalyst 24. However, in place of the solution 110, a suspension inwhich the catalyst 24 is distributed may be used. In other words, thesolution 110 or the suspension may be used as long as the catalyst(predetermined component) 24 is present therein (the same holds true forthe third to fifth embodiments).

Third Embodiment

The third embodiment is a method of manufacturing the carrier 1according to the first embodiment, and includes a process of placing theclosing member 30 on the first end surface 1 a of the carrier 1, and aprocess of spraying a solution.

The carrier 1 before the attachment of the catalyst 24 includes themultiple holes 10. The hole 10 includes the first opening portion 10 aand the second opening portion 10 b on the opposite side of the firstopening portion 10 a. The first opening portion 10 a opens on the firstend surface 1 a. The second opening portion 10 b opens on the second endsurface 1 b.

An arrangement of the multiple holes 10 on the first end surface 1 a isthe same as the arrangement obtained by replacing the attachment holes12 and the non-attachment holes 14 by the holes 10 in the arrangementshown in FIG. 1( a). A hole 10 to which the catalyst 24 is attached isthe attachment hole 12. A hole 10 to which the catalyst 24 is notattached is the non-attachment hole 14.

FIG. 5 shows a partial cross-sectional view (corresponding to FIG. 3(b)) of the carrier 1 according to the third embodiment.

(Process 3-1) Process of Closing

The first opening portions 10 a of the part (the three-by-three holes 10at the center, refer to FIGS. 1( a) and 3(a)) of the multiple holes 10are closed by the closing member 30. It should be noted it is notnecessary to place the closing member 30 on the second end surface 1 b.

(Process 3.2) Process of Spraying

The solution in which a catalyst or promoter is dissolved as a solute issprayed from above toward the first end surface 1 a.

Then, the solution will not flow into the holes 10 (three holes 10 atthe center in FIG. 5) the first opening portions 10 a of which areclosed by the closing member 30. As a result, these holes 10 becomenon-attachment holes 14.

On the other hand, the solution flows into the rest of the holes 10 (twoholes 10 on both ends in FIG. 4.). As a result, the catalyst 24, whichis the solute of the solution 110, attaches to (the partition walls 22enclosing) these holes 10, resulting in the attachment holes 12.

The carrier 1 manufactured in this way becomes the carrier 1 as shown inFIG. 1.

Fourth Embodiment

The fourth embodiment is a method of manufacturing the carrier 1according to the first embodiment, and includes a process of placing theclosing member 30 on the second end surface 1 b of the carrier 1, and aprocess of immersing the carrier 1 in the solution.

The carrier 1 before the attachment of the catalyst 24 includes themultiple holes 10. The hole 10 includes the first opening portion 10 aand the second opening portion 10 b on the opposite side of the firstopening portion 10 a. The first opening portion 10 a opens on the firstend surface 1 a. The second opening portion 10 b opens on the second endsurface 1 b.

An arrangement of the multiple holes 10 on the first end surface 1 a isthe same as the arrangement obtained by replacing the attachment holes12 and the non-attachment holes 14 by the holes 10 in the arrangementshown in FIG. 1( a). A hole 10 to which the catalyst 24 is attached isthe attachment hole 12. A hole 10 to which the catalyst 24 is notattached is the non-attachment hole 14.

(Process 4-1) Process of Closing

The second opening portions 10 b of the part (the three-by-three holes10 at the center, refer to FIGS. 1( a) and 3(a)) of the multiple holes10 are closed by the closing member 30. It should be noted it is notnecessary to place the closing member 30 on the first end surface 1 a.

(Process 4-2) Process of Immersing

FIGS. 6( a) and 6(b) are partial cross-sectional views of the carrier 1according to the fourth embodiment, in which FIG. 6( a) is a partialcross-sectional view of the carrier 1 when the carrier 1 is beingimmersed in the solution 110 (corresponding to FIG. 3( b)), and FIG. 6(b) is a partial cross-sectional view of the carrier 1 after theimmersion in the solution 110 (corresponding to FIG. 3( b)).

The container 100 stores the solution 110 in which a catalyst or apromoter is dissolved as a solute. After the closing member 30 is placedon the second end surface 1 b, the carrier 1 is immersed in the solution110. It should be noted that the liquid surface of the solution 110 isconfigured so as to be higher than the second end surface 1 b, and so asto be lower than the first end surface 1 a.

Then, the solution 110 will not flow into the holes 10 (three holes 10at the center in FIG. 6( a)) the second opening portions 10 b of whichare closed by the closing member 30. As a result, these holes 10 becomenon-attachment holes 14.

On the other hand, the solution 110 flows into the rest of the holes 10(two holes 10 on both ends in FIG. 6( a)). As a result, the catalyst 24,which is the solute of the solution 110, attaches to (the partitionwalls 22 enclosing) these holes 10, resulting in the attachment holes12. However, the liquid surface of the solution 110 reaches only a midlevel of the holes 10, and the catalyst 24 thus reaches only the midlevel of the holes 10 (refer to FIG. 6( b)).

The state of the carrier 1 manufactured in this way and viewed from thefirst end surface 1 a is the same as that in FIG. 1( a). It should benoted that the partial cross-sectional view of the carrier 1manufactured as described above is like FIG. 6( b). The cross section ofthe non-attachment hole 14 is the same as that shown in FIG. 1( a).However, the cross section of the attachment hole 12 is different fromthat in FIG. 1( a), and the catalyst 24 has reached only to the midlevel of (the partition walls 22 enclosing) the attachment hole 12.

Fifth Embodiment

The fifth embodiment is a method of manufacturing the carrier 1according to the first embodiment, and the carrier 1 is arrangedsideway.

FIG. 7 is a front view when the carrier 1 according to the fifthembodiment is immersed in the solution 110.

The carrier 1 before the attachment of the catalyst 24 includes themultiple holes 10. The hole 10 includes the first opening portion 10 aand the second opening portion 10 b on the opposite side of the firstopening portion 10 a. The first opening portion 10 a opens on the firstend surface 1 a. The second opening portion 10 b opens on the second endsurface 1 b.

A hole 10 to which the catalyst 24 is attached is the attachment hole12. A hole 10 to which the catalyst 24 is not attached is thenon-attachment hole 14.

(Process 5-1) Process of Immersing

The container 100 stores the solution 110 in which a catalyst or apromoter is dissolved as a solute. The carrier 1 is immersed in thesolution 100 so that the liquid surface of the solution 110 is lowerthan the first opening portions 10 a of a part of the multiple holes 10.In order to achieve this state, it is conceived that the carrier 1 isturned sideway, and is immersed in the solution 110, for example.

Then, the solution 110 will not flow into the holes 10 above the liquidsurface of the solution 110. As a result, these holes 10 becomenon-attachment holes 14.

On the other hand, the solution 110 flows into the holes 10 below theliquid surface of the solution 110. As a result, the catalyst 24, whichis the solute of the solution 110, attaches to (the partition walls 22enclosing) these holes 10, resulting in the attachment holes 12.

1. A carrier comprising: an attachment hole to which a predeterminedcomponent attaches; and a non-attachment hole to which the predeterminedcomponent does not attach.
 2. The carrier according to claim 1, whereinthe direction of an extension of the attachment hole and the directionof an extension of the non-attachment hole are parallel with each other.3. The carrier according to claim 1, comprising two end surfaces thatare parallel with each other, wherein the attachment hole and thenon-attachment hole open on the two end surfaces.
 4. A method ofmanufacturing the carrier according to claim 1, wherein the carrierincludes a plurality of holes having a first opening portion and asecond opening portion on an opposite side with respect to the firstopening portion, the method of manufacturing the carrier comprising:closing the first opening portion and the second opening portion of apart of the plurality of holes; and immersing the carrier in a liquid inwhich the predetermined component is present.
 5. A method ofmanufacturing the carrier according to claim 1, wherein the carrierincludes a plurality of holes having a first opening portion and asecond opening portion on an opposite side with respect to the firstopening portion, and a first end surface on which the first openingportion opens, the method of manufacturing the carrier comprising:closing the first opening portion of a part of the plurality of holes;and splaying, toward the first end surface, a liquid in which thepredetermined component is present.
 6. A method of manufacturing thecarrier according to claim 1, wherein the carrier includes a pluralityof holes having a first opening portion and a second opening portion onan opposite side with respect to the first opening portion, a first endsurface on which the first opening portion opens, and a second endsurface on which the second opening portion opens, the method ofmanufacturing the carrier comprising: closing the second opening portionof a part of the plurality of holes; and immersing the carrier in aliquid in which the predetermined component is present such that theliquid surface of the liquid is higher than the second end surface andlower than the first end surface.
 7. A method of manufacturing thecarrier according to claim 1, wherein the carrier includes a pluralityof holes having a first opening portion and a second opening portion onan opposite side with respect to the first opening portion, and a firstend surface on which the first opening portion opens, the method ofmanufacturing the carrier comprising: immersing the carrier in a liquidin which the predetermined component is present such that the liquidsurface of the liquid is lower than the first opening portion of a partof the plurality of holes.
 8. An attachment quantity measurement devicecomprising: an electromagnetic wave output device that outputs anelectromagnetic wave to be measured having a frequency equal to orhigher than 0.01 [THz] and equal to or lower than 100 [THzI toward thecarrier according to claim 1; an electromagnetic wave detector thatdetects the electromagnetic wave to be measured which has transmittedthrough the carrier; a reference value deriving unit that derives, basedon a result detected by the electromagnetic wave detector, any one of anabsorption rate, a group delay, and a dispersion of the electromagneticwave to be measured in the non-attachment hole; and an attachmentquantity deriving unit that derives, based on the result detected by theelectromagnetic wave detector and the result derived by the referencevalue deriving unit, a weight or a density of the predeterminedcomponent present in the attachment hole.
 9. The attachment quantitymeasurement device according to claim 8, comprising: a rotational driveunit that rotates the carrier or a travel direction of theelectromagnetic wave to be measured while a line in a directionperpendicular to the travel direction of the electromagnetic wave to bemeasured is set as a rotational axis; and a linear drive unit that movesthe carrier or the travel direction of the electromagnetic wave to bemeasured in a direction perpendicular to the travel direction of theelectromagnetic wave to be measured and the rotational axis, wherein thedetection is carried out by the electromagnetic wave detector while therotational drive unit and the linear drive unit are operating.
 10. Anattachment quantity measurement method using an attachment quantitymeasurement device including: an electromagnetic wave output device thatoutputs an electromagnetic wave to be measured having a frequency equalto or higher than 0.01 [THz] and equal to or lower than 100 [THz] towardthe carrier according to claim 1; and an electromagnetic wave detectorthat detects the electromagnetic wave to be measured which hastransmitted through the carrier; said attachment quantity measurementmethod comprising: deriving a reference value, based on a resultdetected by the electromagnetic wave detector, any one of an absorptionrate, a group delay, and a dispersion of the electromagnetic wave to bemeasured in the non-attachment hole; and deriving an attachmentquantity, based on the result detected by the electromagnetic wavedetector and the result derived by the reference value deriving step, aweight or a density of the predetermined component present in theattachment hole.
 11. A program of instructions for execution by acomputer to perform an attachment quantity measurement process using anattachment quantity measurement device including: an electromagneticwave output device that outputs an electromagnetic wave to be measuredhaving a frequency equal to or higher than 0.01 [THz] and equal to orlower than 100 [THz] toward the carrier according to claim 1; and anelectromagnetic wave detector that detects the electromagnetic wave tobe measured which has transmitted through the carrier; said attachmentquantity measurement process comprising: deriving a reference value,based on a result detected by the electromagnetic wave detector, any oneof an absorption rate, a group delay, and a dispersion of theelectromagnetic wave to be measured in the non-attachment hole; andderiving an attachment quantity, based on the result detected by theelectromagnetic wave detector and the result derived by the deriving ofthe reference value, a weight or a density of the predeterminedcomponent present in the attachment hole.
 12. A computer-readable mediumhaving a program of instructions for execution by a computer to performan attachment quantity measurement process using an attachment quantitymeasurement device including an electromagnetic wave output device thatoutputs an electromagnetic wave to be measured having a frequency equalto or higher than 0.01 [THz] and equal to or lower than 100 [THz] towardthe carrier according to claim 1; and an electromagnetic wave detectorthat detects the electromagnetic wave to be measured which hastransmitted through the carrier; said attachment quantity measurementprocess comprising: deriving a reference value, based on a resultdetected by the electromagnetic wave detector, any one of an absorptionrate, a group delay, and a dispersion of the electromagnetic wave to bemeasured in the non-attachment hole; and deriving an attachmentquantity, based on the result detected by the electromagnetic wavedetector and the result derived by the deriving of the reference value,a weight or a density of the predetermined component present in theattachment hole.